FSB52006S footprint, schematic symbol and 3D model by onsemi

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FSB52006S - onsemi PCB footprint - Other - Other - FSB52006S-1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for FSB52006S
Part Number FSB52006S
Manufacturer onsemi
Pin Count 23
Part Category Power Supply
Package Category Other
Footprint Name Other - FSB52006S-1
Released Date Jan 30, 2019
Last Modified Date Sep 19, 2024 2:45 PM UTC
Pinout / Pin List Click Here (Member Only)

FSB52006S Details

Manufacturer Part Number:
FSB52006S
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
SMD-023
Package Description:
SPM-23
Manufacturer Package Code:
MODEH
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Analog IC - Other Type:
AC MOTOR CONTROLLER
JESD-30 Code:
R-XDMA-G23
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
23
Output Current-Max:
5 A
Package Body Material:
UNSPECIFIED
Package Code:
DMA
Package Equivalence Code:
MODULE,23LEAD,0.7
Package Shape:
RECTANGULAR
Package Style:
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Supply Current-Max (Isup):
0.16 mA
Supply Voltage-Max (Vsup):
16.5 V
Supply Voltage-Min (Vsup):
13.5 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

FSB52006S Frequently Asked Questions (FAQs)

The maximum junction temperature (Tj) that the FSB52006S can withstand is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
To ensure the FSB52006S is properly biased, follow the recommended biasing scheme in the datasheet, which includes connecting the gate to a voltage source through a resistor and capacitor. Additionally, ensure the drain-source voltage (Vds) is within the recommended range and the gate-source voltage (Vgs) is within the specified threshold voltage range.
For optimal thermal management, use a PCB layout that provides good thermal conductivity, such as a copper pour or thermal vias, to dissipate heat away from the device. Ensure the device is mounted on a heat sink or thermal pad, and follow the recommended land pattern and soldering guidelines in the datasheet.
Yes, the FSB52006S is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly biased and the PCB layout is optimized for high-frequency operation to minimize parasitic inductance and capacitance.
To protect the FSB52006S from ESD, follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Ensure that the device is properly grounded during assembly and testing, and consider adding ESD protection devices, such as TVS diodes, to the circuit.

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