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FSB660A - onsemi

Description: Bipolar Transistors - BJT PNP Transistor Low Saturation

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PCB Footprints
FSB660A - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - OT−23/SUPERSOT−23, 3 LEAD, 1.4x2.9 CASE 527AG ISSUE A
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3D Models
FSB660A - onsemi  - 3D model - SOT23 (3-Pin) - OT−23/SUPERSOT−23, 3 LEAD, 1.4x2.9 CASE 527AG ISSUE A
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FSB660A Details

  • Manufacturer Part Number:

    FSB660A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23-3

  • Package Description:

    SUPERSOT-3

  • Manufacturer Package Code:

    527AG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    250

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    75 MHz

FSB660A Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FSB660A is -40°C to 150°C.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the EN pin to a logic-level signal (e.g., 3.3V or 5V) to enable the device.
  • Use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity by using thermal vias and a heat sink if necessary. Keep the device away from high-current paths and heat sources.
  • Use proper PCB layout techniques, such as separating high-frequency and low-frequency circuits, and consider adding noise filters or shielding to minimize EMI.
  • Choose components with suitable voltage and current ratings, and consider factors like ESR, ESL, and temperature coefficient when selecting capacitors and inductors.

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FSB660A Overview

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