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FUSB302B10MPX - onsemi

Description: Ability to connect as either a host or a device based on what has been attached. ; Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Dead Battery Support (SNK Mode Support when No Power Applied); Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Automatic soft reset packet sent with retries if needed ; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Low Power Operation: ICC = 25 µA (Typical); Automatic

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PCB Footprints
FUSB302B10MPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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3D Models
FUSB302B10MPX - onsemi  - 3D model - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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FUSB302B10MPX Details

  • Manufacturer Part Number:

    FUSB302B10MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-14

  • Package Description:

    MLP-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302B10MPX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FUSB302B10MPX involves keeping the high-speed USB traces short and away from noise sources, using a solid ground plane, and minimizing vias and layer changes. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure EMC compliance, follow proper PCB layout and routing guidelines, use a shielded USB connector, and add EMI filtering components such as ferrite beads or common-mode chokes to the USB lines. Additionally, ensure that the device is properly grounded and that the system meets the relevant EMC standards.
  • The FUSB302B10MPX supports USB 2.0 high-speed data transfer rates, which have a maximum cable length of 3 meters (10 feet). However, the actual cable length may be limited by the specific application and the quality of the cable.
  • The FUSB302B10MPX has an internal voltage regulator that generates the required voltage levels for the device. However, external power management is still required to ensure that the device operates within its specified voltage range. A suitable power management IC and decoupling capacitors should be used to regulate the input voltage and filter out noise.
  • The FUSB302B10MPX has a maximum junction temperature of 125°C. To ensure reliable operation, the device should be mounted on a PCB with a thermal pad connected to a solid ground plane, and the system should be designed to keep the device temperature below 85°C. A thermal analysis should be performed to ensure that the device operates within its specified temperature range.

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FUSB302B10MPX Overview

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