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FUSB302TV01MPX - onsemi

Description: Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel.; Current Capability Detection as Device; USB Power Delivery (PD) 2.0, Version 1.1 Support ; Current Capability Indication as Host; Low Power Operation: ICC = 25 µA (Typical); Automatic Hard Reset Ordered Set Sent ; Dual-Role Functionality with Autonomous DRP Toggle ; Audio Adapter Accessory Mode; Default CC open for SRC application.; Automatic retries of sending a packet if a GoodCRC is not received

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PCB Footprints
FUSB302TV01MPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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3D Models
FUSB302TV01MPX - onsemi  - 3D model - Quad Flat No-Lead - WQFN14 2.5x2.5, 0.5P CASE 510BR ISSUE O
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FUSB302TV01MPX Details

  • Manufacturer Part Number:

    FUSB302TV01MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WQFN-14

  • Manufacturer Package Code:

    510BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2018-12-10

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    SEATED HT-CALCULATED

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N14

  • JESD-609 Code:

    e4

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC14,.1SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FUSB302TV01MPX Frequently Asked Questions (FAQs)

  • The recommended PCB layout for FUSB302TV01MPX involves keeping the device as close as possible to the USB connector, using a solid ground plane, and minimizing the length of the USB data lines. Additionally, it's recommended to use a common mode filter and a shielded cable to reduce EMI.
  • To ensure reliable operation of FUSB302TV01MPX in high-temperature environments, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermal interface material, and keeping the device within its recommended operating temperature range (−40°C to +105°C).
  • When selecting bypass capacitors for FUSB302TV01MPX, consider the capacitor's voltage rating, capacitance value, and equivalent series resistance (ESR). A 1 μF to 10 μF ceramic capacitor with a low ESR (< 1 Ω) is recommended for bypassing the VBUS pin, while a 100 nF to 1 μF capacitor is suitable for bypassing the VDD pin.
  • To troubleshoot issues with FUSB302TV01MPX, start by verifying the device's power supply, checking for proper PCB layout and routing, and ensuring that the device is properly configured and initialized. Use tools like oscilloscopes or logic analyzers to debug the USB signals and identify any issues with the device's communication with the host.
  • When using FUSB302TV01MPX in a USB-C application with Power Delivery (PD) capabilities, ensure that the device is properly configured to support PD, and that the system is designed to handle the increased power delivery capabilities. Additionally, consider the implications of PD on the system's power management and thermal design.

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FUSB302TV01MPX Overview

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