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FZ3600R17HP4_B2 - Infineon

Description: IGBT Modules IGBT 1700V 3600A

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FZ3600R17HP4_B2 - Infineon  - 3D model
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FZ3600R17HP4_B2 Details

  • Manufacturer Part Number:

    FZ3600R17HP4_B2

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Pin Count:

    9

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    3600 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    COMPLEX

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X5

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    3

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    21000 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    2095 ns

  • Turn-on Time-Nom (ton):

    945 ns

  • VCEsat-Max:

    2.25 V

FZ3600R17HP4_B2 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure proper heat dissipation, minimize parasitic inductances, and optimize signal integrity.
  • When selecting a gate driver, consider the FZ3600R17HP4_B2's gate charge, threshold voltage, and switching frequency. Ensure the gate driver can provide sufficient current and voltage to charge/discharge the gate capacitance quickly and efficiently.
  • Monitor the FZ3600R17HP4_B2's temperature, voltage, and current. Implement overcurrent, overvoltage, and overtemperature protection mechanisms using external circuitry or a dedicated IC. Also, consider implementing undervoltage lockout and overtemperature shutdown.
  • Follow Infineon's guidelines for PCB layout, component placement, and shielding. Use proper filtering, decoupling, and grounding techniques to minimize EMI. Ensure the design meets relevant EMC standards and regulations.
  • The FZ3600R17HP4_B2's reliability and lifetime depend on factors like operating conditions, thermal management, and quality of the assembly process. Ensure proper thermal management, avoid overheating, and follow Infineon's recommended operating conditions to maximize lifespan.

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FZ3600R17HP4_B2 Overview

Use the download button to access the FZ3600R17HP4_B2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FZ360, or try a keyword search, such as IGBTs

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