Part Image

FZ600R17KE4 - Infineon

Description: IGBT Modules IGBT Module 600A 1700V

Download FZ600R17KE4 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
FZ600R17KE4 - Infineon  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

FZ600R17KE4 Details

  • Manufacturer Part Number:

    FZ600R17KE4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Pin Count:

    5

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    840 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • JESD-30 Code:

    R-XUFM-X3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    930 ns

  • Turn-on Time-Nom (ton):

    355 ns

FZ600R17KE4 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage transient is 20% above the maximum rated drain-source voltage (VDS) for a duration of less than 10 ms. Exceeding this may damage the device.
  • Yes, the FZ600R17KE4 is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout, decoupling, and snubber circuits to minimize electromagnetic interference (EMI) and ringing.
  • Handle the device with ESD-protective equipment, use an ESD-protected workstation, and follow proper handling and storage procedures. Also, consider using ESD protection devices or circuits in the application.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

FZ600R17KE4 Overview

Use the download button to access the FZ600R17KE4 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FZ600, or try a keyword search, such as IGBTs

Parts related to FZ600R17KE4

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview