Part Image

FZ800R12KE3 - Infineon

Description: 62mmC-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled 3diode

Download FZ800R12KE3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
FZ800R12KE3 - Infineon  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

FZ800R12KE3 Details

  • Manufacturer Part Number:

    FZ800R12KE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MODULE

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    1200 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3550 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1000 ns

  • Turn-on Time-Nom (ton):

    440 ns

  • VCEsat-Max:

    2.15 V

FZ800R12KE3 Frequently Asked Questions (FAQs)

  • The recommended gate resistor value is typically between 10 ohms to 20 ohms, depending on the specific application and switching frequency. However, it's recommended to consult the application note or contact Infineon support for more specific guidance.
  • Proper thermal management is crucial for the FZ800R12KE3. Ensure good thermal contact between the module and the heat sink, use a thermal interface material if necessary, and maintain a maximum junction temperature of 150°C. Consult the datasheet and application notes for more information.
  • The FZ800R12KE3 can withstand a maximum overcurrent of 2.5 times the nominal current (800A) for a short duration (typically 10ms). However, it's recommended to design the system to operate within the specified current ratings to ensure reliability and longevity.
  • Yes, the FZ800R12KE3 can be used in a parallel configuration, but it's essential to ensure that the modules are properly matched, and the gate drives are synchronized to prevent uneven current sharing. Consult the application notes and Infineon support for more information.
  • The recommended dead time for the FZ800R12KE3 is typically between 1us to 3us, depending on the specific application and switching frequency. However, it's recommended to consult the application notes and Infineon support for more specific guidance.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

FZ800R12KE3 Overview

Use the download button to access the FZ800R12KE3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FZ800, or try a keyword search, such as IGBTs

Parts related to FZ800R12KE3

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview