Part Image

GD200HFY120C2S - STARPOWER

Description: Dual IGBT, 200 A 1200 V, 7-Pin Module, Screw Mount

Download GD200HFY120C2S Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
GD200HFY120C2S - STARPOWER  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

GD200HFY120C2S Details

  • Manufacturer Part Number:

    GD200HFY120C2S

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    StarPower Europe AG

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    309 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    6.8 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X7

  • Number of Elements:

    2

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1006 W

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    423 ns

  • Turn-on Time-Nom (ton):

    182 ns

  • VCEsat-Max:

    2.15 V

GD200HFY120C2S Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device on a multi-layer board with a solid ground plane, using thermal vias to dissipate heat, and keeping the component placement symmetrical to minimize thermal gradients. A thermal management strategy involving a heat sink or thermal interface material is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure proper thermal management, and consider using a thermally conductive material or heat sink to dissipate heat. Additionally, consider using a thermal sensor to monitor the device temperature and implement over-temperature protection.
  • To prevent damage, it's recommended to follow the manufacturer's recommended soldering profile, use a soldering iron with a temperature-controlled tip, and avoid applying excessive force or bending during handling. It's also essential to store the devices in a dry, ESD-protected environment.
  • To troubleshoot and diagnose issues, start by verifying the device's pinout and connections, checking for signs of physical damage or overheating, and reviewing the system's power supply and signal integrity. Use oscilloscopes or logic analyzers to capture waveforms and identify anomalies. Consult the datasheet and application notes for guidance on specific troubleshooting procedures.
  • Operating the device beyond the recommended specifications can lead to reduced reliability, decreased performance, and increased risk of failure. It's essential to adhere to the recommended operating conditions, including voltage, current, and temperature ranges, to ensure the device's longevity and performance.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

GD200HFY120C2S Overview

Use the download button to access the GD200HFY120C2S 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like GD200, or try a keyword search, such as IGBTs

Parts related to GD200HFY120C2S

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview