EASY INTERFACE BETWEEN UART, SERIAL-PORT CONNECTOR OF IBM PC/AT
Differential Output:
NO
Driver Number of Bits:
3
High Level Input Current-Max:
0.00001 A
Input Characteristics:
SCHMITT TRIGGER
Interface IC Type:
LINE TRANSCEIVER
Interface Standard:
EIA-232-F; TIA-232-F; V.28
JESD-30 Code:
R-PDIP-T20
JESD-609 Code:
e4
Length:
25.4 mm
Number of Functions:
3
Number of Terminals:
20
Operating Temperature-Max:
70 °C
Out Swing-Min:
12 V
Output Characteristics:
OPEN-COLLECTOR
Output Low Current-Max:
0.00001 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
DIP
Package Equivalence Code:
DIP20,.3
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Qualification Status:
Not Qualified
Receive Delay-Max:
150 ns
Receiver Number of Bits:
5
Seated Height-Max:
5.08 mm
Supply Current-Max:
25 mA
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
5 V
Supply Voltage1-Max:
15 V
Supply Voltage1-Min:
7.5 V
Supply Voltage1-Nom:
9 V
Surface Mount:
NO
Technology:
BIPOLAR
Temperature Grade:
COMMERCIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Transmit Delay-Max:
175 ns
Width:
7.62 mm
GD75232N Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the GD75232N datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short, using a solid ground plane, and minimizing noise coupling. Additionally, ensure the decoupling capacitors are placed close to the device and connected to the power pins.
The GD75232N has a thermal pad on the bottom of the package, which is connected to the die. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink or a thermal pad on the PCB. Keep the surrounding components at a safe distance to prevent thermal interference.
The GD75232N is specified to operate up to 100 MHz, but the actual frequency limit depends on the system design, PCB layout, and signal quality. In practice, the device can operate at higher frequencies, but this may require careful signal integrity analysis and optimization.
To configure the GD75232N for differential signaling, connect the differential pairs (e.g., IN+ and IN-) to the corresponding pins on the device. Ensure the differential signals are properly terminated, and the common-mode voltage is within the specified range. Refer to the datasheet for specific pin connections and configuration details.
The recommended power-up sequence for the GD75232N is to apply the power supply voltage (VCC) before the input signals. This ensures the device is properly initialized and configured before the input signals are applied. A slow power-up ramp (e.g., 1-2 ms) can also help prevent latch-up or other issues.
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GD75232N Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
