EASY INTERFACE BETWEEN UART, SERIAL-PORT CONNECTOR OF IBM PC/AT
Differential Output:
NO
Driver Number of Bits:
3
High Level Input Current-Max:
0.00001 A
Input Characteristics:
SCHMITT TRIGGER
Interface IC Type:
LINE TRANSCEIVER
Interface Standard:
EIA-232-F; TIA-232-F; V.28
JESD-30 Code:
R-PDSO-G20
JESD-609 Code:
e4
Length:
6.5 mm
Moisture Sensitivity Level:
1
Number of Functions:
3
Number of Terminals:
20
Operating Temperature-Max:
70 °C
Out Swing-Min:
12 V
Output Characteristics:
OPEN-COLLECTOR
Output Low Current-Max:
0.01 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSSOP
Package Equivalence Code:
TSSOP20,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Receive Delay-Max:
150 ns
Receiver Number of Bits:
5
Seated Height-Max:
1.2 mm
Supply Current-Max:
25 mA
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
5 V
Supply Voltage1-Max:
15 V
Supply Voltage1-Min:
7.5 V
Supply Voltage1-Nom:
9 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
COMMERCIAL
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transmit Delay-Max:
175 ns
Width:
4.4 mm
GD75232PWE4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure reliable operation over the entire operating temperature range (-40°C to 125°C), it's crucial to follow proper thermal design and management practices. This includes selecting components with suitable temperature ratings, using thermal vias, and providing adequate heat sinking and airflow. Additionally, consider using thermal simulation tools to analyze and optimize your design.
To minimize EMI and RFI, follow good design practices such as using a shielded enclosure, keeping sensitive traces away from noisy components, and using EMI filters or chokes. Additionally, consider using a spread-spectrum clock generator to reduce EMI emissions. Texas Instruments also provides EMI and RFI mitigation guidelines in the datasheet and application notes.
To optimize power consumption and reduce heat generation, consider using a low-power mode, reducing the clock frequency, and minimizing the number of active circuits. Additionally, use power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) techniques to reduce power consumption. Texas Instruments provides power consumption estimates and optimization guidelines in the datasheet and application notes.
Texas Instruments provides a comprehensive test and validation procedure in the datasheet and application notes. This includes testing the device's functionality, performance, and power consumption under various operating conditions. Additionally, consider using industry-standard testing and validation procedures, such as those outlined in the IEC 62380 standard.
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GD75232PWE4 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
