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GG25LJ - STMicroelectronics

Description: Battery Management CONDITIONING & INTERFACES

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Symbol
GG25LJ - STMicroelectronics - PCB symbol
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PCB Footprints
GG25LJ - STMicroelectronics PCB footprint - BGA - BGA - CSP 1.40 x 2.04 mm
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3D Models
GG25LJ - STMicroelectronics - 3D model - BGA - CSP 1.40 x 2.04 mm
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GG25LJ Details

  • Manufacturer Part Number:

    GG25LJ

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CSP-10

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    SEATED HT-CALCULATED

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-PBGA-B10

  • Length:

    2.01 mm

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA10,3X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Seated Height-Max:

    0.705 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.37 mm

GG25LJ Frequently Asked Questions (FAQs)

  • A good PCB layout for the GG25LJ should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers to reduce thermal resistance. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the GG25LJ. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • Handle the GG25LJ by the body, avoiding touching the leads or die. Store the devices in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions to prevent damage.
  • While the GG25LJ is a high-performance device, it's essential to consult with STMicroelectronics or a qualified representative to determine its suitability for high-reliability or aerospace applications, as it may require additional testing and qualification.
  • To troubleshoot common issues, start by verifying the PCB layout, thermal management, and input voltage. Check for signs of overheating, such as excessive current or voltage drops. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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GG25LJ Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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