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GS2971AIBE3 - SEMTECH

Description: 3Gb/s, HD, SD SDI Receiver, with Integrated Adaptive Cable Equalizer complete with SMPTE Audio and Video Processing 100-ball BGA -40°C to 85°C

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PCB Footprints
GS2971AIBE3 - SEMTECH PCB footprint - BGA - BGA - 100-ball LBGA 11mm x 11mm x 1.7mm
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3D Models
GS2971AIBE3 - SEMTECH  - 3D model - BGA - 100-ball LBGA 11mm x 11mm x 1.7mm
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GS2971AIBE3 Details

  • Manufacturer Part Number:

    GS2971AIBE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    11 X 11 MM, ROHS COMPLIANT, MO-192, LBGA-100

  • Pin Count:

    100

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Semtech Corporation

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

GS2971AIBE3 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature. Additionally, consider using thermal protection devices and implementing over-temperature protection in your design.
  • Critical timing parameters include the clock frequency, data rate, and signal rise/fall times. To ensure proper signal integrity, use controlled impedance traces, and consider using signal termination and filtering to minimize signal reflections and noise.
  • For troubleshooting, use a logic analyzer or oscilloscope to capture and analyze the signal waveforms. Check the device's power supply, clock, and data signals for any anomalies. Consult the datasheet and application notes for guidance on debugging common issues.
  • The GS2971AIBE3 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is powered up and down correctly, and consider using latch-up protection circuits in your design.

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GS2971AIBE3 Overview

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