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H11D1 - Isocom

Description: Optoisolator

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H11D1 - Isocom - PCB symbol
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PCB Footprints
H11D1 - Isocom PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP
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3D Models
H11D1 - Isocom - 3D model - Dual-In-Line Packages - DIP
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H11D1 Details

  • Manufacturer Part Number:

    H11D1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, DIP-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Isocom Components

  • YTEOL:

    6

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    300 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    20%

  • Current Transfer Ratio-Nom:

    20%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.1 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.25 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

H11D1 Frequently Asked Questions (FAQs)

  • The recommended storage condition for H11D1 is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • Yes, H11D1 is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to consult with Isocom Components or a qualified engineer to ensure the device meets the specific vibration requirements of your application.
  • H11D1 is sensitive to electrostatic discharge (ESD). To prevent damage, handle the device with ESD-protected equipment, wear an ESD wrist strap, and ensure the device is properly grounded during assembly and testing.
  • The maximum operating temperature range for H11D1 is -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and it's recommended to consult the datasheet for specific temperature-related specifications.
  • H11D1 is not designed for use in humid or high-moisture environments. If your application requires operation in such conditions, consider using a hermetically sealed or moisture-resistant version of the device, or consult with Isocom Components for custom solutions.

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H11D1 Overview

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