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H11F1SM - onsemi

Description: As a remote variable resistor: ; ≥ 100GΩ I/O isolation resistanceAs an analog switch: ; No charge injection or latch-up; ≤ 100Ω to ≥ 300MΩ; ≤ 15pF shunt capacitance; UL recognized (File #E90700); 60 Vpk-pk signal capability; Extremely low offset voltage

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H11F1SM - onsemi - PCB symbol
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PCB Footprints
H11F1SM - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - PDIP6 8.51x6.35, 2.54P
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3D Models
H11F1SM - onsemi - 3D model - SOT23 (6-Pin) - PDIP6 8.51x6.35, 2.54P
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H11F1SM Details

  • Manufacturer Part Number:

    H11F1SM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-6

  • Manufacturer Package Code:

    646BY

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.75 V

  • Isolation Voltage-Max:

    7500 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    1 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    FET OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    0.000025 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

H11F1SM Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the H11F1SM is 4.5V to 5.5V, with a typical operating voltage of 5V.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and decouple the power supply with a 0.1uF capacitor. Additionally, ensure the input signals are within the recommended voltage range.
  • The maximum frequency of operation for the H11F1SM is 100 MHz, but this can vary depending on the specific application and operating conditions.
  • To handle thermal considerations, ensure good airflow around the device, and consider using a heat sink if the device will be operating at high temperatures or high frequencies.
  • For optimal performance, use a symmetrical layout and routing, with minimal trace lengths and impedance mismatches. Avoid running high-frequency signals near the device's power and ground pins.

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