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H11F3SM - onsemi

Description: 60 Vpk-pk signal capability; ≥ 100GΩ I/O isolation resistanceAs an analog switch: ; As a remote variable resistor: ; ≤ 15pF shunt capacitance; ≤ 100Ω to ≥ 300MΩ; UL recognized (File #E90700); No charge injection or latch-up; Extremely low offset voltage

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H11F3SM - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - H11F3SM-1
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H11F3SM Details

  • Manufacturer Part Number:

    H11F3SM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-6

  • Manufacturer Package Code:

    646BY

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    15 V

  • Configuration:

    SINGLE

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.75 V

  • Isolation Voltage-Max:

    7500 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    1 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    FET OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    0.000025 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

H11F3SM Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's current and voltage ratings according to the datasheet.
  • The H11F3SM has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
  • Yes, the H11F3SM is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the application's switching frequency is within the device's recommended operating range.
  • To troubleshoot issues with the H11F3SM, start by reviewing the application's schematic and PCB layout, checking for any design or layout errors. Then, use a multimeter or oscilloscope to measure the device's voltage and current, and check for any signs of overheating or thermal stress.

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H11F3SM Overview

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