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H11G2SR2M - onsemi

Description: 80 V Minimum for H11G2M; DIN-EN/IEC60747-5-5, 850 V Peak Working Insulation Voltage; UL1577, 4,170 VACRMS for 1 Minute; 100 V Minimum for H11G1M; Safety and Regulatory Approvals:; High Sensitivity to Low Input Current (Minimum 500% CTR at IF= 1 mA); High BVCEO:; Low Leakage Current at Elevated Temperature (Maximum 100 μA at 80°C)

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H11G2SR2M - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - PDIP6 8.51x6.35, 2.54P CASE 646BY ISSUE A_2
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H11G2SR2M Details

  • Manufacturer Part Number:

    H11G2SR2M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-6

  • Package Description:

    SURFACE MOUNT PACKAGE-6

  • Manufacturer Package Code:

    646BY

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    500%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    4170 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    DARLINGTON OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.26 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

H11G2SR2M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • A gate driver with a high current capability (e.g., 1A) and a low output impedance is recommended. The gate driver should be able to provide a voltage swing of at least 10V to ensure proper switching.
  • Use a voltage regulator or a voltage clamp to limit the voltage across the device. Add a current sense resistor and a fuse or a current limiter to protect against overcurrent. Consider using a TVS diode or a zener diode for overvoltage protection.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body, not the leads, to prevent damage.

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H11G2SR2M Overview

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