H5DU2562GTR-E3C - Hynix

H5DU2562GTR-E3C Details

• Manufacturer Part Number:

  H5DU2562GTR-E3C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TSOP2

• Package Description:

  0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66

• Pin Count:

  66

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.24

• Manufacturer:

  SK Hynix Inc

• YTEOL:

  0

• Access Mode:

  FOUR BANK PAGE BURST

• Access Time-Max:

  0.7 ns

• Additional Feature:

  AUTO/SELF REFRESH

• Clock Frequency-Max (fCLK):

  200 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  2,4,8

• JESD-30 Code:

  R-PDSO-G66

• JESD-609 Code:

  e6

• Length:

  22.225 mm

• Memory Density:

  268435456 bit

• Memory IC Type:

  DDR1 DRAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  66

• Number of Words:

  16777216 words

• Number of Words Code:

  16000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  16MX16

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP66,.46

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.194 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  2,4,8

• Standby Current-Max:

  0.004 A

• Supply Current-Max:

  0.21 mA

• Supply Voltage-Max (Vsup):

  2.7 V

• Supply Voltage-Min (Vsup):

  2.3 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN BISMUTH

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  20

• Width:

  10.155 mm