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H5TQ2G63FFR-RDC - Hynix

Description: RESET DDR DRAM, 128MX16, 0.195ns, CMOS, PBGA96

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H5TQ2G63FFR-RDC Details

  • Manufacturer Part Number:

    H5TQ2G63FFR-RDC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FBGA-96

  • Pin Count:

    96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    SK Hynix Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Access Time-Max:

    0.195 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    933 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    DDR3 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    128MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.012 A

  • Supply Current-Max:

    0.22 mA

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

H5TQ2G63FFR-RDC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the H5TQ2G63FFR-RDC is 0°C to 85°C, with a maximum storage temperature range of -40°C to 100°C.
  • To ensure signal integrity and reduce noise on the memory bus, it is recommended to use a well-designed PCB with controlled impedance, add decoupling capacitors near the module, and use a clock signal with a high signal-to-noise ratio.
  • The recommended refresh rate for the H5TQ2G63FFR-RDC is 4x per 64ms, which is the standard refresh rate for DDR4 SDRAM modules.
  • The H5TQ2G63FFR-RDC is designed to operate at a voltage supply of 1.2V, but it can also operate at a voltage supply of 1.35V with some performance degradation. However, it is not recommended to use this module with a voltage supply outside of the 1.2V to 1.35V range.
  • The H5TQ2G63FFR-RDC supports error detection and correction mechanisms such as ECC (Error-Correcting Code) and CRC (Cyclic Redundancy Check). It is recommended to implement error handling mechanisms in the system design to detect and correct errors during memory access.

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H5TQ2G63FFR-RDC Overview

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Part Image H5TQ2G63FFR-RDJ SK Hynix Inc

DDR3 DRAM, 128MX16, 0.195ns, CMOS, PBGA96

Part Image H5TQ2G63FFR-RDL SK Hynix Inc

DDR3 DRAM, 128MX16, 0.195ns, CMOS, PBGA96