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H5TQ4G63CFR-RDC - Hynix

Description: FBGA-96 DDR SDRAM ROHS

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H5TQ4G63CFR-RDC - Hynix PCB footprint - BGA - BGA - 96Ball Fine Pitch Ball Grid Array Outline_96
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H5TQ4G63CFR-RDC - Hynix  - 3D model - BGA - 96Ball Fine Pitch Ball Grid Array Outline_96
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H5TQ4G63CFR-RDC Details

  • Manufacturer Part Number:

    H5TQ4G63CFR-RDC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FPBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    SK Hynix Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

H5TQ4G63CFR-RDC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for this module is 0°C to 85°C.
  • To ensure signal integrity, it is recommended to use a signal integrity analysis tool to simulate the signal transmission and optimize the PCB design. Additionally, following the recommended routing and termination guidelines in the datasheet can help minimize signal degradation.
  • The H5TQ4G63CFR-RDC module is designed to operate at a voltage supply of 1.2V. Using it with a different voltage supply may affect its performance and reliability. It is recommended to use the module with the specified voltage supply to ensure optimal performance.
  • The module uses a 72-bit data bus with 8 bits for error correction. The module also supports retry mechanisms to handle errors. It is recommended to implement error detection and correction mechanisms in the system design to handle errors and retries.
  • The maximum bandwidth of the H5TQ4G63CFR-RDC module is 3200 MT/s.

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H5TQ4G63CFR-RDC Overview

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Part Image H5TQ4G63CFR-RDI SK Hynix Inc

DDR3 DRAM, 256MX16, CMOS, PBGA96