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H5TQ4G83EFR-RDC - Hynix

Description: DDR3-1866 512Mx8 (4Gb)

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H5TQ4G83EFR-RDC Details

  • Manufacturer Part Number:

    H5TQ4G83EFR-RDC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    SK Hynix Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    11 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    512MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

H5TQ4G83EFR-RDC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for this module is 0°C to 85°C, with a storage temperature range of -40°C to 100°C.
  • To ensure signal integrity and reduce noise on the memory bus, it is recommended to use a well-designed PCB with controlled impedance, add decoupling capacitors near the module, and use a clock signal with a high slew rate.
  • The recommended voltage for the VDD and VDDQ power supplies is 1.2V ± 0.06V, with a maximum tolerance of ± 5%.
  • The module supports auto-refresh and self-refresh modes. The controller should send refresh commands to the module during normal operation, and the module will enter self-refresh mode when the clock is stopped or the chip select is de-asserted.
  • The maximum number of devices that can be connected to a single memory bus depends on the system design and loading, but generally, it is recommended to limit the number of devices to 2-4 to ensure signal integrity and reduce loading.

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