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HCPL-316J-500E - Avago Technologies

Description: 2.5A Gate Driver Optical Coupling 5000Vrms 1 Channel 16-SO

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HCPL-316J-500E - Avago Technologies - PCB symbol
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HCPL-316J-500E - Avago Technologies PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Surface Mount_2021
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HCPL-316J-500E - Avago Technologies - 3D model - Small Outline Packages - 16-Lead Surface Mount_2021
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HCPL-316J-500E Details

  • Manufacturer Part Number:

    HCPL-316J-500E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP, SOP16,.46

  • Pin Count:

    16

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.312 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.632 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.5 µs

  • Turn-on Time:

    0.5 µs

  • Width:

    7.493 mm

HCPL-316J-500E Frequently Asked Questions (FAQs)

  • A good PCB layout for HCPL-316J-500E involves keeping the input and output circuits separate, using a ground plane, and minimizing track lengths and widths to reduce electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended temperature range (-40°C to 100°C), and consider using a heat sink or thermal management system to prevent overheating.
  • HCPL-316J-500E has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and handling to prevent damage. Use an ESD wrist strap or mat, and ensure that all equipment is grounded.
  • HCPL-316J-500E is rated for up to 500Vrms, but it's essential to ensure that the device is used within its recommended voltage range and that proper isolation is maintained between the input and output circuits.
  • To troubleshoot issues with HCPL-316J-500E, check the input voltage, ensure proper PCB layout and grounding, verify that the device is operated within its recommended temperature range, and consult the datasheet and application notes for guidance.

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HCPL-316J-500E Overview

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