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HD3SS213ZQER - Texas Instruments

Description: 5.4Gbps DisplayPort 1.2a 2:1/1:2 Differential Switch

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PCB Footprints
HD3SS213ZQER - Texas Instruments PCB footprint - BGA - BGA - ZQE-50
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3D Models
HD3SS213ZQER - Texas Instruments  - 3D model - BGA - ZQE-50
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HD3SS213ZQER Details

  • Manufacturer Part Number:

    HD3SS213ZQER

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    S-PBGA-B50

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Terminals:

    50

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    5 mA

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

HD3SS213ZQER Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS213ZQER involves keeping the high-speed signals away from the power planes, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce EMI.
  • The HD3SS213ZQER requires a 1.8V power supply for the digital core and a 3.3V power supply for the analog circuitry. The power sequencing requirement is to power up the 1.8V supply first, followed by the 3.3V supply. It's also recommended to use a power-on reset circuit to ensure that the device is properly reset during power-up.
  • The HD3SS213ZQER has a maximum junction temperature of 125°C. To prevent overheating, it's recommended to use a heat sink or a thermal pad on the exposed pad of the device. Additionally, ensuring good airflow around the device and using a PCB with a thermal via can help to dissipate heat.
  • The HD3SS213ZQER can be configured for different USB modes using the USB_CFG pins. For example, to configure the device for USB 3.0 mode, the USB_CFG pins should be set to 01. For USB 3.2 Gen 1 mode, the pins should be set to 10. The specific configuration depends on the desired USB mode and the application requirements.
  • The HD3SS213ZQER has built-in ESD protection, but it's still recommended to take precautions to prevent ESD damage. This includes using ESD-protective packaging and handling, using an ESD wrist strap or mat, and ensuring that the device is powered down during handling and storage.

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HD3SS213ZQER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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