Part Image

HD3SS214IZXHR - Texas Instruments

Description: Multiplexer Switch ICs 8.1 Gbps DisplayPort 1.4 1-to-2 / 2-to-1 differential mux supports DDC/AUX switching 50-NFBGA

Download HD3SS214IZXHR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
HD3SS214IZXHR - Texas Instruments PCB footprint - BGA - BGA - ZQE-50
click to zoom
3D Models
HD3SS214IZXHR - Texas Instruments  - 3D model - BGA - ZQE-50
click to zoom

HD3SS214IZXHR Details

  • Manufacturer Part Number:

    HD3SS214IZXHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Input Voltage-Max:

    1.8 V

  • Input Voltage-Min:

    -1.8 V

  • JESD-30 Code:

    S-PBGA-B50

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    50

  • Off-state Isolation-Nom:

    26 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA50,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

HD3SS214IZXHR Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS214IZXHR involves keeping the high-speed signals away from the power and ground planes, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce EMI.
  • The HD3SS214IZXHR requires a 1.8V power supply for the digital core and a 3.3V power supply for the analog circuitry. The power sequencing requirement is to power up the 1.8V supply first, followed by the 3.3V supply. It's also recommended to use a power-on reset circuit to ensure that the device is properly reset during power-up.
  • The HD3SS214IZXHR has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, ensure that the PCB is designed to dissipate heat efficiently, and consider using thermal vias to dissipate heat from the device to the PCB.
  • The HD3SS214IZXHR can be configured for different USB modes by setting the appropriate registers and pins. For example, to configure the device for USB 3.0 mode, set the USB_MODE pin to '1' and configure the device for SuperSpeed operation using the USB3_CFG register. Refer to the datasheet and application notes for specific configuration details.
  • Common pitfalls to avoid when designing with the HD3SS214IZXHR include improper power sequencing, inadequate decoupling, and poor PCB layout. To troubleshoot common issues, use a logic analyzer to debug the USB signals, check the power supply voltages, and verify that the device is properly configured for the desired USB mode.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

HD3SS214IZXHR Overview

Use the download button to access the HD3SS214IZXHR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HD3SS, or try a keyword search, such as Multiplexers or Switches

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to HD3SS214IZXHR

Showing 0 results