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HD3SS214ZQER - Texas Instruments

Description: 8.1Gbps DisplayPort 1.3 2:1/1:2 Differential Switch

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PCB Footprints
HD3SS214ZQER - Texas Instruments PCB footprint - BGA - BGA - ZQE-50
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3D Models
HD3SS214ZQER - Texas Instruments  - 3D model - BGA - ZQE-50
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HD3SS214ZQER Details

  • Manufacturer Part Number:

    HD3SS214ZQER

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    BGA-50

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    S-PBGA-B50

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    50

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA50,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

HD3SS214ZQER Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS214ZQER involves keeping the high-speed signals away from the power and ground planes, using a solid ground plane, and minimizing the length of the traces. Additionally, it's recommended to use a common mode filter or a ferrite bead to reduce EMI.
  • The HD3SS214ZQER requires a 1.8V power supply for the digital core and a 3.3V power supply for the analog circuitry. The power sequencing requirement is to power up the 1.8V supply first, followed by the 3.3V supply. It's also recommended to use a power-on reset circuit to ensure the device is properly reset during power-up.
  • The HD3SS214ZQER supports cable lengths up to 3 meters for USB 3.0 and 5 meters for USB 2.0. However, the actual cable length supported may vary depending on the specific application and the quality of the cable.
  • To implement a robust USB 3.0 link using the HD3SS214ZQER, ensure that the device is properly configured and initialized, use a high-quality cable that meets the USB 3.0 specification, and implement error detection and correction mechanisms to handle data transmission errors.
  • The HD3SS214ZQER has a maximum junction temperature of 125°C. To ensure reliable operation, it's recommended to keep the device temperature below 85°C. This can be achieved by using a heat sink, improving air flow, and reducing the power consumption of the device.

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HD3SS214ZQER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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