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HD3SS214ZXHR - Texas Instruments

Description: Multiplexer Switch ICs 8.1 Gbps DisplayPort 1.4 1-to-2 / 2-to-1 differential mux supports DDC/AUX switching 50-NFBGA

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HD3SS214ZXHR - Texas Instruments - PCB symbol
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PCB Footprints
HD3SS214ZXHR - Texas Instruments PCB footprint - BGA - BGA - ZXH0050A
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3D Models
HD3SS214ZXHR - Texas Instruments - 3D model - BGA - ZXH0050A
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HD3SS214ZXHR Details

  • Manufacturer Part Number:

    HD3SS214ZXHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Input Voltage-Max:

    1.8 V

  • Input Voltage-Min:

    -1.8 V

  • JESD-30 Code:

    S-PBGA-B50

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    50

  • Off-state Isolation-Nom:

    26 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA50,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

HD3SS214ZXHR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and grounding to minimize EMI and ensure reliable operation.
  • The HD3SS214ZXHR requires a 1.8V to 3.3V power supply, and it's recommended to power the device in the following sequence: VCC, then VCC_IO, and finally VCC_USB. A 10uF capacitor is recommended between VCC and GND, and a 1uF capacitor between VCC_IO and GND.
  • The HD3SS214ZXHR supports cable lengths up to 3 meters, and it's recommended to use a shielded cable with a characteristic impedance of 90 ohms to minimize signal degradation and EMI.
  • The HD3SS214ZXHR can be configured for different USB modes using the MODE pin. For example, tying the MODE pin to GND selects USB 2.0 mode, while tying it to VCC selects USB 3.0 mode. Refer to the datasheet for specific configuration details.
  • The HD3SS214ZXHR has a recommended operating temperature range of -40°C to 85°C. To ensure thermal management, it's recommended to provide a thermal pad on the PCB, and to use a heat sink or thermal interface material if the device is expected to operate in high-temperature environments.

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HD3SS214ZXHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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