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HD3SS215ZQER - Texas Instruments

Description: HDMI 2.0/DisplayPort 1.2a, 6.0 Gbps 2:1/1:2 Differential Switch

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PCB Footprints
HD3SS215ZQER - Texas Instruments PCB footprint - BGA - BGA - ZXH0050A
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3D Models
HD3SS215ZQER - Texas Instruments  - 3D model - BGA - ZXH0050A
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HD3SS215ZQER Details

  • Manufacturer Part Number:

    HD3SS215ZQER

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    BGA-81/50

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    S-PBGA-B50

  • Length:

    5 mm

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    50

  • Off-state Isolation-Nom:

    21 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    14 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA50,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    3.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    20000 ns

  • Switch-on Time-Max:

    1000 ns

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    5 mm

HD3SS215ZQER Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS215ZQER involves keeping the high-speed signals away from the power planes, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce EMI.
  • The HD3SS215ZQER requires a 1.8V power supply for the digital core and a 3.3V power supply for the analog circuitry. The power sequencing requirement is to power up the 1.8V supply first, followed by the 3.3V supply. It's also recommended to use a power-on reset circuit to ensure that the device is properly reset during power-up.
  • The HD3SS215ZQER has a maximum junction temperature of 125°C. To prevent overheating, it's recommended to use a heat sink or a thermal pad on the exposed pad of the device. Additionally, ensuring good airflow around the device and using a PCB with a thermal via can help to dissipate heat.
  • The HD3SS215ZQER can be configured for different USB modes using the MODE_SEL pins. For example, to configure the device for USB 3.0 mode, the MODE_SEL pins should be set to 01. For USB 3.2 Gen 1 mode, the MODE_SEL pins should be set to 10. The specific configuration depends on the desired USB mode and the application requirements.
  • To ensure reliable data transmission, it's recommended to use a controlled impedance PCB design, use signal termination resistors, and minimize the length of the USB traces. Additionally, using a common mode filter or a USB 3.0 signal repeater can help to improve signal integrity.

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HD3SS215ZQER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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