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HD3SS3202RSVT - Texas Instruments

Description: Two-channel differential 2:1/1:2 USB3.1 mux & demux

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PCB Footprints
HD3SS3202RSVT - Texas Instruments PCB footprint - Other - Other - HD3SS3202RSVT-3
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3D Models
HD3SS3202RSVT - Texas Instruments  - 3D model - Other - HD3SS3202RSVT-3
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HD3SS3202RSVT Details

  • Manufacturer Part Number:

    HD3SS3202RSVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    10000 MHz

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    0.7 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

HD3SS3202RSVT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the HD3SS3202RSVT evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and thermal management.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and thermal management guidelines in the datasheet. Additionally, consider using thermal interface materials, heat sinks, and/or fans to maintain a safe junction temperature.
  • When using the HD3SS3202RSVT in a system with multiple voltage domains, ensure that the device is properly powered and that voltage transitions do not exceed the recommended specifications. Additionally, consider using level shifters or voltage translators to ensure signal integrity and prevent damage to the device.
  • To troubleshoot issues with the HD3SS3202RSVT, start by reviewing the datasheet and application notes to ensure proper usage and configuration. Then, use debugging tools such as oscilloscopes, logic analyzers, and/or JTAG interfaces to identify the root cause of the issue. Texas Instruments also provides technical support and resources to help with troubleshooting.
  • When using the HD3SS3202RSVT in a system with high-speed signals or high-frequency noise, ensure that the device is properly bypassed and decoupled to minimize the impact of noise on the device's operation. Additionally, consider using signal integrity techniques such as shielding, filtering, and/or termination to reduce the effects of high-frequency noise.

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HD3SS3202RSVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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