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HD3SS460RHRT - Texas Instruments

Description: USB Type-C Alternate Mode 4x6 Differential Switch

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Symbol
HD3SS460RHRT - Texas Instruments - PCB symbol
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PCB Footprints
HD3SS460RHRT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN28
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3D Models
HD3SS460RHRT - Texas Instruments - 3D model - Quad Flat No-Lead - WQFN28
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HD3SS460RHRT Details

  • Manufacturer Part Number:

    HD3SS460RHRT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 4:6

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    2700 MHz

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Off-state Isolation-Nom:

    50 dB

  • On-state Resistance Match-Nom:

    8 Ω

  • On-state Resistance-Max (Ron):

    14 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.14X.22,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.9 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    3000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

HD3SS460RHRT Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS460RHRT involves keeping the high-speed signals away from the power planes, using a solid ground plane, and minimizing the length of the traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The HD3SS460RHRT requires a 1.8V power supply for the core and a 3.3V power supply for the I/O. The power sequencing requirement is to power up the 1.8V core voltage before the 3.3V I/O voltage. It's also recommended to use a power-on reset circuit to ensure the device is properly reset during power-up.
  • The HD3SS460RHRT has a thermal pad that must be connected to a solid ground plane to dissipate heat. It's recommended to use a thermal interface material between the device and the heat sink, and to ensure good airflow around the device. The maximum junction temperature is 125°C, and the device should be operated within the recommended temperature range to ensure reliability.
  • The HD3SS460RHRT can be configured for USB 3.0 and USB 2.0 modes by setting the appropriate registers. For USB 3.0 mode, the device must be configured for SuperSpeed mode, and for USB 2.0 mode, the device must be configured for High-Speed mode. The configuration is done through the device's registers, and the specific settings depend on the application requirements.
  • The HD3SS460RHRT has built-in ESD protection, but it's still recommended to take precautions during handling and assembly to prevent ESD damage. It's also recommended to use ESD protection devices on the USB signals to prevent damage from external ESD events.

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HD3SS460RHRT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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