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HD3SS6126RUAR - Texas Instruments

Description: USB 3.0 + USB2.0 Differential Switch 2:1/1:2 MUX/DEMUX

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HD3SS6126RUAR - Texas Instruments - PCB symbol
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PCB Footprints
HD3SS6126RUAR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RUA (R-PWQFN-N42)_2
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3D Models
HD3SS6126RUAR - Texas Instruments - 3D model - Quad Flat No-Lead - RUA (R-PWQFN-N42)_2
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HD3SS6126RUAR Details

  • Manufacturer Part Number:

    HD3SS6126RUAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    10000 MHz

  • JESD-30 Code:

    R-PQCC-N42

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO

  • Number of Channels:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    42

  • Off-state Isolation-Nom:

    85 dB

  • On-state Resistance Match-Nom:

    0.7 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWQCCN

  • Package Equivalence Code:

    LCC42,.14X.35,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.003 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    10 ns

  • Switch-on Time-Max:

    17 ns

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

HD3SS6126RUAR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed signals away from the power plane and use a shielded cable for the USB interface. Refer to the TI application note 'PCB Layout Guidelines for HD3SS6126RUAR' for more details.
  • The HD3SS6126RUAR requires a 3.3V power supply for VCC and a 1.8V power supply for VCCIO. Power sequencing is critical; VCC must be powered up before VCCIO. A soft-start circuit can be used to ensure a smooth power-up sequence.
  • The HD3SS6126RUAR has a thermal pad that must be connected to a solid ground plane for heat dissipation. Use a thermal interface material (TIM) to improve heat transfer. Ensure good airflow around the device and avoid blocking the thermal pad. Monitor the device temperature using the THERM pin.
  • The HD3SS6126RUAR can be configured for USB 3.0 or USB 2.0 operation using the USB_CFG pin. For USB 3.0, tie USB_CFG to VCCIO. For USB 2.0, tie USB_CFG to GND. USB 3.0 mode supports higher speeds (up to 5 Gbps) while USB 2.0 mode supports lower speeds (up to 480 Mbps).
  • The HD3SS6126RUAR has built-in ESD protection, but additional protection measures are recommended. Use ESD-sensitive handling procedures during assembly and storage. Add external ESD protection devices (e.g., TVS diodes) to the USB interface to prevent damage from electrostatic discharge.

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HD3SS6126RUAR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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