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HFA3127BZ - Renesas Electronics

Description: The HFA3046, HFA3096, HFA3127 and the HFA3128 are ultra high frequency transistor arrays that are fabricated from the Renesas complementary bipolar UHF-1 process. Each array consists of five dielectrically isolated transistors on a common monolithic substrate. The NPN transistors exhibit a fT of 8GHz while the PNP transistors provide a fT of 5. 5GHz. Both types exhibit low noise (3. 5dB), making them ideal for high frequency amplifier and mixer applications. The HFA3046 and HFA3127 are all NPN arrays while

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HFA3127BZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 Ld SOIC_1
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HFA3127BZ - Renesas Electronics  - 3D model - Small Outline Packages - 16 Ld SOIC_1
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HFA3127BZ Details

  • Manufacturer Part Number:

    HFA3127BZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.037 A

  • Collector-Base Capacitance-Max:

    0.2 pF

  • Collector-Emitter Voltage-Max:

    8 V

  • Configuration:

    SEPARATE, 5 ELEMENTS

  • DC Current Gain-Min (hFE):

    40

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    MS-012AC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    5

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

HFA3127BZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 100nF) close to the VCC pin.
  • Use a soft-start circuit to ramp up the power supply voltage (VCC) to the recommended operating voltage (3.3V) within 10ms. Ensure the power-on reset (POR) circuit is properly implemented to reset the device during power-on.
  • The recommended clock frequency is 24.576MHz or 25MHz. Ensure the clock signal has a low jitter (<100ps) and a stable amplitude (>2.5Vpp) to ensure reliable operation.
  • Use a low-noise, low-impedance analog input signal. Ensure the analog input voltage range is within the recommended specifications (0-2.5V). Use a capacitor (e.g., 10nF) to filter the analog input signal.
  • Use a 3-wire SPI interface (SCK, MOSI, MISO) to communicate with the microcontroller. Ensure the microcontroller's SPI clock frequency is within the recommended range (1-10MHz).

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HFA3127BZ Overview

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