Part Image

HIP6503CBZ - Renesas Electronics

Description: Power Management Specialised - PMIC W/ANNEAL ACPI PWR MANAGEMNT CIRCUIT

Download HIP6503CBZ Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
HIP6503CBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M20.3
click to zoom
3D Models
HIP6503CBZ - Renesas Electronics  - 3D model - Small Outline Packages - M20.3
click to zoom

HIP6503CBZ Details

  • Manufacturer Part Number:

    HIP6503CBZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    ACPI COMPLIANT LINEAR POWER CONTROLLER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

HIP6503CBZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the HIP6503CBZ near a thermal pad or heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, it's essential to keep the thermal path clear of other components and to use thermal vias to dissipate heat efficiently.
  • To ensure reliable start-up and shutdown of the HIP6503CBZ, it's essential to follow the recommended power-up and power-down sequences. The input voltage should be ramped up slowly (typically 10-20 ms) to prevent inrush currents, and the enable pin should be asserted after the input voltage has reached the minimum operating voltage. During shutdown, the enable pin should be de-asserted before the input voltage is reduced.
  • The critical components that affect the HIP6503CBZ's performance and reliability include the input and output capacitors, the inductor, and the thermal interface material (TIM) between the device and the heat sink. The selection and quality of these components can significantly impact the converter's efficiency, stability, and thermal performance.
  • To troubleshoot common issues with the HIP6503CBZ, such as oscillations or instability, it's essential to follow a systematic approach. This includes checking the PCB layout and component selection, verifying the input and output voltage levels, and monitoring the device's operating frequency and current waveforms. Additionally, it's recommended to consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • The thermal design considerations for the HIP6503CBZ include ensuring good thermal conductivity between the device and the PCB, using a heat sink or thermal pad, and providing adequate airflow. To calculate the junction temperature, you can use the thermal resistance (RθJA) specified in the datasheet, along with the device's power dissipation and ambient temperature. The junction temperature can be calculated using the formula: Tj = Ta + (RθJA * Pd).

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

HIP6503CBZ Overview

Use the download button to access the HIP6503CBZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HIP65, or try a keyword search, such as Power Management Circuits

Parts related to HIP6503CBZ

Showing 0 results