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HM1-6617/883 - Renesas Electronics

Description: The HM-6617/883 is a 16, 384-bit fuse link CMOS PROM in a 2K word by 8-bit/word format with "Three-State" outputs. This PROM is available in the standard 0. 600 inch wide 24 pin SBDIP, the 0. 300 inch wide slim SBDIP, and the JEDEC standard 32 pad CLCC. The HM-6617/883 utilizes a synchronous design technique. This includes on-chip address latches and a separate output enable control which makes this device ideal for applications utilizing recent generation microprocessors. This design technique, combined wi

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HM1-6617/883 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F24.6
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HM1-6617/883 - Renesas Electronics  - 3D model - Ceramic Dual-In-Line Packages - F24.6
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HM1-6617/883 Details

  • Manufacturer Part Number:

    HM1-6617/883

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SBDIP

  • Package Description:

    DIP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    D24.6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Access Time-Max:

    140 ns

  • JESD-30 Code:

    R-CDIP-T24

  • JESD-609 Code:

    e0

  • Memory Density:

    16384 bit

  • Memory IC Type:

    OTP ROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    2KX8

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.72 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

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HM1-6617/883 Overview

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Part Image HM1-6617-9 Harris Semiconductor

OTP ROM, 2KX8, 140ns, CMOS, CDIP24

Part Image HM1-6617-8 Intersil Corporation

2KX8 OTPROM, 140ns, CDIP24

Part Image 5962-8954001LX Harris Semiconductor

OTP ROM, 2KX8, 140ns, CMOS, CDIP24

Part Image 5962-8954001LA Harris Semiconductor

OTP ROM, 2KX8, 140ns, CMOS, CDIP24

Part Image 5962-8954001LX Intersil Corporation

OTP ROM, 2KX8, 140ns, CMOS, CDIP24

For a full list of alternate parts for HM1-6617/883, check out Findchips.com