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HMHA2801AR2V - onsemi

Description: Safety and Regulatory Approvals: ♦ UL1577, 3.750 VACRMS for 1 Minute ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage; These Devices are Pb−Free and are RoHS Compliant; Compact 4−Pin Package: ♦ 2.4 mm Maximum Standoff Height ♦ Half−Pitch Leads for Optimum Board Space Savings

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HMHA2801AR2V - onsemi - PCB symbol
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PCB Footprints
HMHA2801AR2V - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 4-SOIC (0.173", 4.40mm Width)
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3D Models
HMHA2801AR2V - onsemi - 3D model - Small Outline Packages - 4-SOIC (0.173", 4.40mm Width)
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HMHA2801AR2V Details

  • Manufacturer Part Number:

    HMHA2801AR2V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Package Description:

    COMPACT, MINI-FLAT-4

  • Manufacturer Package Code:

    100AL

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    80%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

HMHA2801AR2V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it's recommended to operate the device within the specified voltage and current limits to ensure reliability and prevent damage.
  • The HMHA2801AR2V is not specifically designed for high-reliability or aerospace applications. For such applications, consider using devices with higher reliability ratings, such as those with a higher Mean Time Between Failures (MTBF) or those that meet specific industry standards.
  • Use a systematic approach to troubleshoot: check the PCB layout, thermal design, and power supply quality. Verify that the device is operated within the specified voltage and current limits. Consult the datasheet and application notes for guidance.

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HMHA2801AR2V Overview

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