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HN1C01FU-Y,LF - Toshiba

Description: Bipolar Transistors - BJT NPN + NPN Ind. Transistor, VCEO=50V, IC=0.15A, hFE=120 to 400 in SOT-26 (SM6) package

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Symbol
HN1C01FU-Y,LF - Toshiba - PCB symbol
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PCB Footprints
HN1C01FU-Y,LF - Toshiba PCB footprint - Other - Other - 1-2T1S_2022
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3D Models
HN1C01FU-Y,LF - Toshiba - 3D model - Other - 1-2T1S_2022
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HN1C01FU-Y,LF Details

  • Manufacturer Part Number:

    HN1C01FU-Y,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.15 A

  • Collector-Base Capacitance-Max:

    3.5 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    120

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    80 MHz

  • VCEsat-Max:

    0.25 V

HN1C01FU-Y,LF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the HN1C01FU-Y,LF is a 2.5mm x 1.8mm pad with a 0.5mm radius corner, and a 0.3mm via hole for thermal relief.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Avoid applying excessive force or pressure during soldering.
  • The maximum operating temperature range for the HN1C01FU-Y,LF is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • Handle the HN1C01FU-Y,LF in an ESD-protected environment, using ESD-safe materials and tools. Ground yourself by wearing an ESD strap or using an ESD mat to prevent static electricity damage.
  • The recommended reflow soldering profile for the HN1C01FU-Y,LF is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.

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HN1C01FU-Y,LF Overview

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