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HPA00165DGSR - Texas Instruments

Description: Hot Swap Voltage Controllers Order MFG part # TPS2490DGSR

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PCB Footprints
HPA00165DGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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3D Models
HPA00165DGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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HPA00165DGSR Details

  • Manufacturer Part Number:

    HPA00165DGSR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VSSOP-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    500 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    80 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

HPA00165DGSR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • To ensure stability, follow the recommended component values and PCB layout. Additionally, make sure to decouple the input and output with capacitors, and consider adding a small resistor (e.g., 10 ohms) in series with the output to prevent oscillations. Also, ensure that the input and output impedance are matched to the device's recommended values.
  • The maximum power dissipation for the HPA00165DGSR is not explicitly stated in the datasheet. However, based on the thermal resistance and maximum junction temperature, it's recommended to keep the power dissipation below 1.5W to ensure reliable operation. This can be achieved by keeping the output current below 1A and the input voltage below 5V.
  • The HPA00165DGSR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and ensure that the device is properly cooled to maintain its performance and lifespan.
  • To protect the device from ESD and overvoltage, consider adding external protection components such as TVS diodes, zener diodes, or ESD protection arrays. Additionally, ensure that the input and output pins are not exposed to voltages beyond the recommended operating range.

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HPA00165DGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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