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HPA00615DRVR - Texas Instruments

Description: Power Switch ICs - Power Distribution Adjustable, Active High, Constant-Current, Current-Limited Power-Distribution Switch 6-WSON -40 to 85

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PCB Footprints
HPA00615DRVR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRV0006A
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3D Models
HPA00615DRVR - Texas Instruments  - 3D model - Small Outline No-lead - DRV0006A
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HPA00615DRVR Details

  • Manufacturer Part Number:

    HPA00615DRVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SON-6

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

HPA00615DRVR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Ensure good airflow and avoid thermal hotspots.
  • Use a shielded enclosure, keep high-frequency components away from the edges, and use EMI filters or common-mode chokes to reduce emissions. Ensure proper grounding and decoupling.
  • Use a low-impedance gate drive circuit with a high-current gate driver IC. Ensure the gate drive voltage is within the recommended range (10-15V) and use a gate resistor to limit the current.
  • Monitor the drain-source voltage, drain current, and temperature. Implement overcurrent protection, overvoltage protection, and thermal shutdown to prevent damage.

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HPA00615DRVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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