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HSMS-286K-TR1G - Avago Technologies

Description: Broadcom HSMS-286K-TR1G, Dual SMT Schottky RF Detector Diode, Isolated, 4V 10mA, 6-Pin SOT-363

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HSMS-286K-TR1G - Avago Technologies - PCB symbol
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PCB Footprints
HSMS-286K-TR1G - Avago Technologies PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - HSMS-286K-TR1G
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3D Models
HSMS-286K-TR1G - Avago Technologies - 3D model - SOT23 (6-Pin) - HSMS-286K-TR1G
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HSMS-286K-TR1G Details

  • Manufacturer Part Number:

    HSMS-286K-TR1G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70

  • Package Description:

    R-PDSO-G6

  • Pin Count:

    6

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.35 V

  • Frequency Band:

    C BAND

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

HSMS-286K-TR1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used for the RF signal path.
  • The device requires a single 5V power supply. A 10uF capacitor should be placed between the VCC pin and ground to filter out noise. A 1kohm resistor should be used to bias the device to the desired operating point.
  • The HSMS-286K-TR1G is designed to operate up to 6 GHz, but the maximum operating frequency may vary depending on the specific application and PCB layout.
  • The device has a thermal pad on the bottom that should be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. The device should be placed on a thermal pad on the PCB to ensure proper heat transfer.

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HSMS-286K-TR1G Overview

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HSMS-286K-TR1G Alternates

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Image Part Number Model
Part Image HSMS-286K-TR1 Hewlett Packard Co

Mixer Diode, Ultra High Frequency to C Band, Silicon
Part Image HSMS-286K-TR2G Agilent Technologies Inc

Mixer Diode, Ultra High Frequency to C Band, Silicon
Part Image HSMS-286K-TR2 Agilent Technologies Inc

Mixer Diode, Ultra High Frequency to C Band, Silicon
Part Image HSMS-286K-TR2G Broadcom Limited

Mixer Diode, C Band, Silicon
Part Image HSMS-286K-TR1 Avago Technologies

SILICON, UHF-C BAND, MIXER DIODE
For a full list of alternate parts for HSMS-286K-TR1G, check out Findchips.com