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HUF75639G3 - onsemi

Description: Temperature Compensated PSPICE® and SABER™ Electrical Models; SPICE and SABER Thermal Impedance Models; Peak Current vs Pulse Width Curve; 56A, 100V; UIS Rating Curve

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PCB Footprints
HUF75639G3 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−3LD SHORT LEAD
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HUF75639G3 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−3LD SHORT LEAD
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HUF75639G3 Details

  • Manufacturer Part Number:

    HUF75639G3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    56 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    200 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

HUF75639G3 Frequently Asked Questions (FAQs)

  • The maximum SOA for the HUF75639G3 is not explicitly stated in the datasheet. However, it's recommended to follow the guidelines provided in the application note AND8039/D, which provides SOA curves for similar devices.
  • To ensure proper thermal management, follow the thermal design guidelines provided in the datasheet. Additionally, consider using a heat sink with a thermal resistance of 1°C/W or lower, and ensure good thermal interface material (TIM) contact between the device and heat sink.
  • The recommended gate drive voltage for the HUF75639G3 is between 10V and 15V. However, the optimal gate drive voltage may vary depending on the specific application and switching frequency.
  • Yes, the HUF75639G3 can be used in high-frequency switching applications. However, it's essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the gate drive circuitry is optimized for high-frequency operation.
  • To protect the HUF75639G3 from overvoltage and overcurrent conditions, consider using a voltage clamp or a transient voltage suppressor (TVS) to limit voltage spikes. Additionally, implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.

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HUF75639G3 Overview

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Part Image HUF75639G3 Harris Semiconductor

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