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HUF75652G3 - onsemi

Description: Temperature Compensated PSPICE® and SABER™ Electrical Models; Peak Current vs Pulse Width Curve; Ultra Low On-Resistance  rDS(ON) = 0.008Ω, VGS = 10V; UIS Rating Curve; Spice and SABER Thermal Impedance Models

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HUF75652G3 - onsemi PCB footprint - Other - Other - HUF75652G3-1
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HUF75652G3 Details

  • Manufacturer Part Number:

    HUF75652G3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.008 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    515 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

HUF75652G3 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the HUF75652G3 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and consider using a voltage regulator or bias circuit to maintain stable voltage and current levels.
  • For optimal thermal performance, use a multi-layer PCB with thermal vias, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet and application notes.
  • Handle the device with ESD-protective equipment, and follow proper ESD handling procedures. Use ESD-protective packaging and storage materials, and consider using ESD-protection devices or circuits in the design.
  • Use a gate drive circuit with a high current capability and fast rise/fall times to ensure proper switching. Consider using a dedicated gate driver IC or a discrete gate drive circuit with a high-voltage capacitor and a low-impedance path.

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HUF75652G3 Overview

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HUF75652G3 Alternates

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Image Part Number Model
Part Image HUF75652G3_NL Rochester Electronics LLC

75A, 100V, 0.008ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247

Part Image HUF75652G3 Rochester Electronics LLC

75A, 100V, 0.008ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247

Part Image HUF75652G3 Fairchild Semiconductor Corporation

Power Field-Effect Transistor, 75A I(D), 100V, 0.008ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247

Part Image HUF75652G3 Intersil Corporation

Power Field-Effect Transistor, 75A I(D), 100V, 0.008ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247

Part Image HUF75652G3_NL Fairchild Semiconductor Corporation

Power Field-Effect Transistor, 75A I(D), 100V, 0.008ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247

For a full list of alternate parts for HUF75652G3, check out Findchips.com