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HVDA541QDRQ1 - Texas Instruments

Description: Automotive Catalog 5-V CAN Transceiver with Standby mode, I/O Level Shifting and Supply Optimization

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HVDA541QDRQ1 - Texas Instruments - PCB symbol
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HVDA541QDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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HVDA541QDRQ1 - Texas Instruments - 3D model - Small Outline Packages - D (R-PDSO-G8)
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HVDA541QDRQ1 Details

  • Manufacturer Part Number:

    HVDA541QDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HVDA541QDRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 0.1uF) close to the device's power pins.
  • Use a heat sink or a thermal pad on the exposed pad (EP) of the QFN package. Ensure good airflow around the device. Keep the device's junction temperature (TJ) below 150°C. Monitor the device's thermal metrics, such as thermal resistance (RθJA) and junction-to-ambient thermal resistance (RθJA).
  • Use a shielded enclosure or a metal can to reduce EMI radiation. Keep the device's analog and digital circuits separate. Use a common-mode choke or a ferrite bead to filter out high-frequency noise. Ensure good PCB layout practices, such as minimizing loop areas and using a solid ground plane.
  • The POR and BOR features are enabled by default. Ensure that the power supply ramps up slowly (e.g., 10ms) to allow the device to reset properly. Use an external reset circuit or a supervisor IC to monitor the power supply and generate a reset signal if necessary.
  • Implement redundant systems and error detection mechanisms. Use a watchdog timer to monitor the device's operation. Ensure that the device is properly validated and tested for the specific application. Follow relevant industry standards and guidelines, such as IEC 61508 or ISO 26262.

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HVDA541QDRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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