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HVDA553QDRQ1 - Texas Instruments

Description: Automotive 5-V CAN Transceiver with I/O Level Adapting and Low-Power Mode Supply Optimization

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HVDA553QDRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
HVDA553QDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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HVDA553QDRQ1 - Texas Instruments - 3D model - Small Outline Packages - D0008A
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HVDA553QDRQ1 Details

  • Manufacturer Part Number:

    HVDA553QDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HVDA553QDRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material between the device and the heat sink. Follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure and ensure good grounding practices. Keep the device away from high-frequency sources and use EMI filters or shielding on the input/output lines if necessary.
  • Use a high-voltage-rated capacitor and resistor in series to limit the voltage and current on the input pins. Ensure the output pins are properly terminated and use a voltage limiter or clamp to prevent overvoltage.
  • Power up the device in the following sequence: VCC, VDD, and then the input voltage. Power down in the reverse sequence. Ensure a minimum of 10ms delay between power-up and input signal application.

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HVDA553QDRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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