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ICL3221EFVZ - Renesas Electronics

Description: The ICL3221EM and ICL3221EF devices are 3. 3V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications. Additionally, they provide ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Efficient on-chip charge pumps, coupled with manual and automatic powerdown functions, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board sp

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PCB Footprints
ICL3221EFVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP 16pin
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ICL3221EFVZ - Renesas Electronics  - 3D model - Small Outline Packages - TSSOP 16pin
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ICL3221EFVZ Details

  • Manufacturer Part Number:

    ICL3221EFVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

ICL3221EFVZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ICL3221EFVZ should minimize signal trace lengths, use a solid ground plane, and keep analog and digital signals separate. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of the ICL3221EFVZ in high-temperature environments, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within its recommended operating temperature range.
  • To mitigate EMI and RFI when using the ICL3221EFVZ, it's crucial to use proper shielding, filtering, and grounding techniques. This includes using a metal shield around the device, adding EMI filters to the input and output lines, and ensuring a solid ground connection.
  • To troubleshoot common issues with the ICL3221EFVZ, start by checking the device's power supply, signal integrity, and PCB layout. Verify that the device is properly configured and that the input and output signals are within the recommended specifications. Use oscilloscopes and logic analyzers to debug the issue and consult the datasheet and application notes for guidance.
  • When using the ICL3221EFVZ in a system with multiple power domains, it's essential to ensure that the device is properly powered and that the power domains are properly isolated. This may require the use of level shifters, voltage regulators, and power sequencing circuits to ensure reliable operation.

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ICL3221EFVZ Overview

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