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IFCM30T65GDXKMA1 - Infineon

Description: Power Driver Module IGBT 2 Phase 650 V 30 A 24-PowerDIP Module (1.028", 26.10mm)

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IFCM30T65GDXKMA1 - Infineon PCB footprint - Other - Other - 24-PowerDIP Module (1.028", 26.10mm)
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IFCM30T65GDXKMA1 - Infineon  - 3D model - Other - 24-PowerDIP Module (1.028", 26.10mm)
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IFCM30T65GDXKMA1 Details

  • Manufacturer Part Number:

    IFCM30T65GDXKMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    DIP-24

  • Country Of Origin:

    Austria, Germany, Malaysia, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-MDFM-X24

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    METAL

  • Package Code:

    DFM

  • Package Equivalence Code:

    MODULE,25LEAD,4.0

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    DUAL

IFCM30T65GDXKMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IFCM30T65GDXKMA1 is -40°C to 150°C.
  • Yes, the IFCM30T65GDXKMA1 is AEC-Q101 qualified, making it suitable for automotive applications.
  • The typical switching frequency for the IFCM30T65GDXKMA1 is up to 100 kHz, but it can be operated at frequencies up to 200 kHz with proper design and layout considerations.
  • To ensure proper cooling, it is recommended to use a heat sink with a thermal resistance of ≤ 10 K/W, and to follow the thermal design guidelines provided in the datasheet.
  • Yes, the IFCM30T65GDXKMA1 is designed for high-reliability applications, with a failure rate of ≤ 10 FIT (failures per 10^9 hours) at 125°C.

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