ILQ621GB-X009 footprint, schematic symbol and 3D model by Vishay

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ILQ621GB-X009 Details

Vishay recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Vishay recommends using a soldering temperature of 260°C (max) and a soldering time of 3 seconds (max) to prevent damage to the component. A soldering iron with a temperature control is recommended.
Vishay recommends derating the voltage by 1.5 V per 10°C above 25°C to ensure reliable operation. For example, at 50°C, the maximum allowed voltage would be 15 V - (1.5 V/10°C * 25°C) = 12.5 V.
While the ILQ621GB-X009 is not specifically designed for high-frequency applications, it can be used up to 100 kHz with proper PCB layout and decoupling. However, it's recommended to consult with Vishay's application engineers for specific guidance.
Vishay recommends storing the ILQ621GB-X009 in a dry, cool place with a temperature range of 10°C to 30°C and a relative humidity of 60% or less. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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Use the download button to access the ILQ621GB-X009 schematic symbol, PCB footprint, and 3D model.

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