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IMBG120R090M1HXTMA1 - Infineon

Description: N-Channel 1200 V 26A (Tc) 136W (Tc) Surface Mount PG-TO263-7-12

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IMBG120R090M1HXTMA1 - Infineon PCB footprint - Other - Other - IMBG120R090M1HXTMA1-1
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IMBG120R090M1HXTMA1 Details

  • Manufacturer Part Number:

    IMBG120R090M1HXTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    26 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4.3 pF

  • JEDEC-95 Code:

    TO-263

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    136 W

  • Pulsed Drain Current-Max (IDM):

    65 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

IMBG120R090M1HXTMA1 Frequently Asked Questions (FAQs)

  • The thermal resistance (Rth) of the IMBG120R090M1HXTMA1 is typically around 0.5 K/W, but this value can vary depending on the specific application and cooling conditions.
  • To ensure reliability, it's essential to follow the recommended operating conditions, including temperature, voltage, and current ratings. Additionally, proper thermal management, such as heat sinking and cooling, is crucial to prevent overheating.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and design, including using a solid ground plane, minimizing track lengths, and ensuring adequate decoupling and filtering.
  • To troubleshoot issues, start by verifying the operating conditions, including voltage, current, and temperature. Check for proper thermal management, and ensure that the device is properly soldered and connected. If issues persist, consult Infineon's application notes and technical support resources.
  • Yes, the IMBG120R090M1HXTMA1 is a high-frequency device, and proper EMI and EMC design considerations are crucial. Follow Infineon's guidelines for EMI and EMC design, including using shielding, filtering, and proper layout techniques.

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IMBG120R090M1HXTMA1 Overview

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