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IMH4AT110 - ROHM Semiconductor

Description: Pre-Biased Bipolar Transistor (BJT) 2 NPN - Pre-Biased (Dual) 50V 100mA 250MHz 300mW Surface Mount SMT6

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IMH4AT110 - ROHM Semiconductor PCB footprint - Other - Other - SMT6
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IMH4AT110 - ROHM Semiconductor  - 3D model - Other - SMT6
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IMH4AT110 Details

  • Manufacturer Part Number:

    IMH4AT110

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    DIGITAL

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • VCEsat-Max:

    0.3 V

IMH4AT110 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. ROHM also recommends using a thermistor or temperature sensor to monitor the device temperature.
  • To prevent damage, handle the IMH4AT110 with care to avoid mechanical stress, such as bending or flexing. Store the devices in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the devices to electrostatic discharge (ESD) by using ESD-protective packaging and handling materials.
  • Yes, the IMH4AT110 is suitable for high-reliability and automotive applications. ROHM offers a range of reliability tests and qualifications, including AEC-Q101, to ensure the device meets the required standards. However, it's essential to consult with ROHM or a qualified representative to discuss specific requirements and ensure the device meets the necessary qualifications.
  • To troubleshoot common issues, start by checking the PCB layout and thermal design to ensure optimal heat dissipation. Verify that the device is operated within the recommended specifications and derating curves. Use a thermal camera or temperature sensor to monitor the device temperature. If issues persist, consult the ROHM datasheet and application notes or contact ROHM support for further assistance.

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IMH4AT110 Overview

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