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IMW65R048M1HXKSA1 - Infineon

Description: CoolSiC™ MOSFET 650V – SiC MOSFET delivering reliable and cost-effective performance in TO247 3–pin package

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IMW65R048M1HXKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - pg-to247-3
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IMW65R048M1HXKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - pg-to247-3
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IMW65R048M1HXKSA1 Details

  • Manufacturer Part Number:

    IMW65R048M1HXKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    171 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    39 A

  • Drain-source On Resistance-Max:

    0.064 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    13 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

IMW65R048M1HXKSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and consider using a heat sink with a thermal resistance of less than 10 K/W.
  • Infineon recommends a gate drive voltage of 12-15 V for optimal switching performance and to minimize power losses.
  • Use a fuse or a current sense resistor to detect overcurrent conditions, and consider using a voltage supervisor or a voltage regulator to protect against overvoltage conditions.
  • Infineon recommends a dead time of 100-200 ns to minimize power losses and ensure reliable operation.

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IMW65R048M1HXKSA1 Overview

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