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IMZ120R030M1HXKSA1 - Infineon

Description: MOSFET SIC DISCRETE

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Symbol
IMZ120R030M1HXKSA1 - Infineon - PCB symbol
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PCB Footprints
IMZ120R030M1HXKSA1 - Infineon PCB footprint - Other - Other - PG-TO247-4
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3D Models
IMZ120R030M1HXKSA1 - Infineon - 3D model - Other - PG-TO247-4
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IMZ120R030M1HXKSA1 Details

  • Manufacturer Part Number:

    IMZ120R030M1HXKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    56 A

  • Drain-source On Resistance-Max:

    0.056 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    13 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    227 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

IMZ120R030M1HXKSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area for heat dissipation, and a thermal via array under the device to improve heat transfer. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple to monitor the device temperature.
  • The maximum allowed voltage transient on the input pins is 20% above the maximum recommended operating voltage, but not exceeding 40V. Exceeding this may cause damage to the device.
  • Yes, the IMZ120R030M1HXKSA1 is qualified according to AEC-Q101, making it suitable for high-reliability applications such as automotive systems. However, additional testing and validation may be required depending on the specific application.
  • Follow standard ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Ensure that the device is stored in its original packaging or an ESD-safe container when not in use.

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IMZ120R030M1HXKSA1 Overview

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