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IPA80R280P7XKSA1 - Infineon

Description: N-Channel 800 V 17A (Tc) 30W (Tc) Through Hole PG-TO220-3-31

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Symbol
IPA80R280P7XKSA1 - Infineon - PCB symbol
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PCB Footprints
IPA80R280P7XKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO220FullPAK_2026
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3D Models
IPA80R280P7XKSA1 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO220FullPAK_2026
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IPA80R280P7XKSA1 Details

  • Manufacturer Part Number:

    IPA80R280P7XKSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    43 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain-source On Resistance-Max:

    0.28 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPA80R280P7XKSA1 Frequently Asked Questions (FAQs)

  • The IPA80R280P7XKSA1 can operate from -40°C to 150°C, making it suitable for high-temperature applications.
  • Proper cooling can be achieved through a combination of heat sinks, thermal interfaces, and airflow. Ensure the device is mounted on a suitable heat sink and follow the recommended thermal design guidelines.
  • Follow the recommended PCB layout guidelines provided in the datasheet, including keeping the power and ground planes separate, using a solid ground plane, and minimizing trace lengths and widths.
  • Ensure the PCB is designed to handle high currents by using thick copper traces, multiple vias, and a robust power delivery network. Also, consider using a suitable DC-DC converter or power supply to meet the device's power requirements.
  • The IPA80R280P7XKSA1 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing to prevent damage.

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IPA80R280P7XKSA1 Overview

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