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IPB09N03LAG - Infineon

Description: MOSFET N-Ch 25V 50A D2PAK-2

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IPB09N03LAG - Infineon PCB footprint - Other - Other - IPB037N06N3 G-2
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IPB09N03LAG Details

  • Manufacturer Part Number:

    IPB09N03LAG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    GREEN, PLASTIC, TO-263, 3 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    75 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0151 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    63 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPB09N03LAG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPB09N03LAG is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Typically, a gate-source voltage (Vgs) of 10-15V and a drain-source voltage (Vds) of 30-40V are recommended. Additionally, ensure the device is properly cooled to prevent overheating.
  • For optimal thermal management, it's recommended to use a PCB with a thermal pad and a heat sink. Ensure the thermal pad is connected to a solid ground plane and the heat sink is properly attached to the device. A good PCB layout should also minimize parasitic inductance and capacitance.
  • To protect the device from overvoltage and overcurrent conditions, use a voltage regulator or a voltage limiter to ensure the input voltage stays within the recommended range. Additionally, consider using a current sense resistor and a fuse to detect and prevent overcurrent conditions.
  • The recommended gate driver for IPB09N03LAG is typically a high-current, low-impedance driver with a voltage rating that matches the device's Vgs rating. Examples include the Infineon Technologies AG's 1EDC and 2EDC gate driver families.

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IPB09N03LAG Overview

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